
REGISTRATION IS NOW OPEN!
Presenting authors must submit their abstract ID during registration. Abstract without a registered presenting author will be cancelled by Thursday, October 1, 2026. The conference will conclude at noon of Wednesday, Oct. 14. Please consult the mini-symposia organizers regarding your presentation time before the final program is released.
Registration includes breakfast, lunch, coffee breaks each day, receptions on Sunday and Monday, and banquet on Tuesday at $20.
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Note: Abstract IDs are allocated to the time slots. Non-registered abstracts will be dropped off from the program on 10/1/2026
Google Chrome is the recommended browser to utilize for registering.
IMPORTANT DATES
Open for mini-symposium submission: Nov. 1, 2025
Deadline for mini-symposium submission: Jan. 12, 2026
Open for abstract submission: Feb.11, 2026
Deadline for abstract submission: May 8, 2026
Open for early registration: May 18, 2026
- Regular attendee registration: $800; Student registration: $400
Open for Regular registration: Sept 1, 2026
- Late regular attendee registration: $900; Student registration: $500
Late registration: Oct. 1, 2026 NOTE: Abstract without a registered presenting author will be cancelled by Thursday, October 1, 2026.
- Regular attendee registration: $1000; Student registration: $500
Conference: Oct. 11-14, 2026 Onsite registration will be available.
IT ALL STARTED HERE
Did you know that Society of Engineering Science originated at Purdue? SES founder A.C. Eringen originally came to Purdue in 1953 as a professor of aerospace and mechanical engineering. He wanted to foster cooperation and discussion among scientists and engineers of diverse backgrounds. As a result, in November 1963 he welcomed to Purdue's campus more than 400 physicists, chemists, mathematicians, and engineers from around the world, and from all types of specializations. One of the featured speakers was Vladimir Zworykin, inventor of the cathode ray tube for television.

SPONSORS
SES2026 is held with the backing of the School of Mechanical Engineering at Purdue University.
We gratefully acknowledge the support of the following sponsors: Purdue University, NSF, Ansys, Comsol and MeshOS AI

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