Personal Information - Energy Efficiency Scaling for 2 Decades (EES2)

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Enablers - Unites the four former “enabler” working groups: Power and Control Electronics, Manufacturing Energy Efficiency, Metrology and Benchmarking, and Education and Workforce Development. Additionally covers facility-level technologies such as power distribution, cooling systems, and datacenter-level metrology.
Materials and Devices - Includes technologies such as carbon nanotubes, spintronics, superconducting computing, and reversible computing.
Circuits and Architectures - Includes technologies such compute-in-memory, non-volatile memory, and domain-specific architectures.
Advanced Packaging and Heterogeneous Integration - Includes technologies such as 2.5D and 3D geometries, optical, superconducting, and topological interconnects, as well as new strategies for thermal mitigation between stacked chips.
Algorithms and Software - Includes technologies such as software for domain-specific and emerging architectures, efficient ML algorithms, and nature-inspired neuromorphic algorithms.
Communications, Sensors and Controls- Addresses the energy efficiency of communications, including 5G/6G wireless communications and networks between datacenters. Also works on sensors and controls and telemetry integration in microelectronic systems.
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